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Loctite - Encapsulants and Underfills

Microelectronics assembly using flip chip and direct chip attach is an emerging trend within the electronics industry. To facilitate the move to bare-die assembly, highly reliable protection materials must be provided which allow fast production cycles. Loctite Underfills and Encapsulants offer extremely reliable protection combined with ultra-high process speeds. 3563, 3564, 3565, 3510 Loctite Underfills 3532, 3533, 3534 Loctite Encapsulants